3236 scott boulevard santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 cmm3030-bd features ? small size ? high gain: 10 db typical ? output voltage up to 7.5 v peak-to-peak ? 30 khz to 30 ghz bandwidth ? low gain ripple: 1.0 db pp typical ? sub 0.25 micron phemt applications ? driver amplifier for linb0 3 modulator @ oc192 bit rate sonet/shd transmission systems ? medium power linear gain block for broadband systems description the cmm3030-bd is a precision gaas mmic, medium power amplifier and is part of celeritek s family of widefiber products. the cmm3030-bd optical driver amplifier gives fiber optic system designers a unique combination of wide- band frequency coverage, along with a flat response and very low internal jitter. it is a precision phemt gaas mmic medium power amplifier with +23 dbm @ p1db. it operates from 30 khz to 30 ghz with a 10 db linear gain. low inter- nal jitter makes it especially well suited for high speed digital data applications. maximum output voltage is 7.5 v peak-to- peak. it is an excellent choice as a driver amplifier for lithium niobate external optical modulators, to acheive high extinction ratio. targeted for oc-192 and other high speed applications, the bit rate can be as high as 15 gb/s. the bias voltage can be adjusted to reduce the output voltage as needed. cmm3030-bd amplifiers are shipped in gel pack from celeritek s foundry. 30 khz to 30 ghz gaas mmic optical modulator driver amplifier advanced product information november 2000 (1 of 2) chip diagram specifications (t a = 25?, v dd = 8v) parameters units min typ max frequency range 30 khz 30.0 ghz small signal gain db 9.0 10.0 gain flatness db 0.5 0.75 input/output vswr 1.8:1 2.0:1 power output (@1 db gain compression) dbm 22.0 23.0 second order intercept point dbm 40.0 third order intercept point dbm 30.0 current ma 225 275 units in microns
3236 scott boulevard, santa clara, california 95054 phone: (408) 986-5060 fax: (408) 986-5095 cmm3030-bd advanced product information - november 2000 (2 of 2) celeritek reserves the right to make changes without further notice to any products herein. celeritek makes no warranty, repres entation or guarantee regarding the suitability of its products for any particular purpose, nor does celeritek assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?ypical?parameters can and do vary in different applications. all operating parameters, including ?ypicals?must be validated for each customer application by customer s technical experts. celeritek doe s not convey any license under its patent rights nor the rights of others. celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the celeritek prod uct could create a situation where personal injury or death may occur. should buyer purchase or use celeritek products for any such unintended or unauthorized application, buyer shall indemnify and hold celeritek and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that celeritek was negligent regarding the design or manufacture of the part. celeritek is a registered trademark of celeritek, inc. celeritek, inc. is an e qual opportunity/affirmative action employer. ordering information part number for ordering system application/description CMM3030-BD-0048 oc-48/stm-16 cmm3030-bd-0192 oc-192/stm-64 absolute maximum ratings parameter rating drain voltage 12 v gate voltage -5 v drain current 350 ma continuous power dissipation 3.0 w channel temperature +175? storage temperature -65? to +175? mounting temperature +320? input power +23 dbm die attach and bonding procedures die attach: eutectic die attach is recommended. for eutec- tic die attach: preform: ausn (80% au, 20% sn); stage temperature: 290?, 5?; handling tool: tweezers; time: 1 min or less. wire bonding: wire size: 0.7 to 1.0 mil in diameter (pre- stressed); thermocompression bonding is preferred over thermosonic bonding. for thermocompression bonding: stage temperature: 250?; bond tip temperature: 150?; bonding tip pressure: 18 to 40 gms depending on size of wire. schematic diagram
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